半导体产业 12

• 中国 AI 超节点的供应链：架构跑到了组件前面 —— WAIC 2026 全景与缺口清单 2026/09/21
• J.P. Morgan 电子元件数据手册解读：AI 服务器如何重写 MLCC 需求结构（62 页全图复刻） 2026/09/12
• AMD 混合键合 3D DRAM 解读：如何理解 17 倍能效，以及量产前的热难题 2026/09/05
• Enhancing SoC HW/SW Co-Verification with FPGA-Based Prototyping — 用 FPGA 原型验证打通 SoC 软硬协同 2026/09/05
• SerDes Part 2: The Bigger Picture Behind the Copper–Optics War — 铜光之战大局：SerDes 是系统级公司的入场券 2026/08/13
• Is Optical Connectivity the Next Bottleneck in AI Data Centers? — 光互联会是 AI 数据中心的下一个瓶颈吗？ 2026/08/11
• Taiwan GTC (Computex 2026): CPO Just Entered Production, So Why Are Coherent and Lumentum, the Companies It Was Supposed to Kill, Still on the Supplier List? — 台湾、GTC 与 Computex 2026：CPO 已进入量产 2026/08/02
• Winway Copackaged Optics (CPO) Talk — WinWay 与共封装光学（CPO）访谈 2026/08/02
• The Critical Bottleneck in CPO Mass Production? It's Testing — CPO 测试的市场机会 2026/08/02
• AMD, Qualcomm Debut New Packaging Technologies — AMD 与 Qualcomm 首发新一代先进封装 2026/08/02
• TSMC Is Ahead in CPO. Samsung Is Putting a Third Chip Next to HBM — 台积电 CPO 领先，三星把第三颗芯片贴到 HBM 旁 2026/07/21
• The 100-Second Bottleneck Behind NVIDIA CPO — CPO 测试瓶颈与四阶段测试栈 2026/07/19