硅光 12

• 从 SerDes 到光纤：可交互的 NPO 光电链路实验室 2026/09/12
• A Deep Dive of GeSi Electro-Absorption Modulators and Marvell/Celestial AI's OMIB for 200Gbps+ Interconnects — 中文解读 2026/08/25
• What Will It Take To Deploy CPO At Scale? — CPO 规模部署的最后一公里：制造、测试与运营 2026/08/19
• 光子时代正在到来：为什么 AI 的真正瓶颈是互连而非算力 2026/08/07
• CPO, Fully Dissected [CPO Special Part 2] — CPO 全拆解（CPO 专题篇） 2026/08/02
• Co-Packaged Optics (CPO) Book – Scaling with Light for the Next Wave of Interconnect — 共封装光学（CPO）与 Book 式扩展 2026/08/02
• CPO's Biggest Bottleneck Is Not Optics—It Is High-Volume Testing — CPO 的最大瓶颈不是光学，是量产测试 2026/07/28
• Silicon Photonics Architecture: Quantifying Link Budgets and Optical Nonidealities — 硅光架构：链路预算与光非理想性的量化 2026/07/23
• Optics Primer, Part 3: Co-Packaged Optics (CPO) — 共封装光学 CPO 入门：从 EML/DSP 到硅光与外部 CW 激光 2026/07/21
• The Illusion of CPO [CPO Special Final] — CPO 的幻象：方向人人都懂，坐标才分高下 2026/07/21
• TSMC Is Ahead in CPO. Samsung Is Putting a Third Chip Next to HBM — 台积电 CPO 领先，三星把第三颗芯片贴到 HBM 旁 2026/07/21
• A Comprehensive Overview of High-Speed Optical Communications — 高速光通信全景：从 IM-DD、VCSEL 到硅光与相干光学 2026/07/20