供应链 9

• CPO 量产的闸门从对准精度转向测试速度：TrendForce 拆解光测试供应链七个环节 —— 研究稿精读 2026/10/14
• 一块基板不再通吃：先进封装基板为何走向应用专用化 —— Semiconductor Engineering 精读 2026/10/04
• NPO Company Map — 下一波光收入驱动因素的公司版图 2026/08/27
• Google's TPU Supply Chain — 中文解读 2026/08/25
• Is Optical Connectivity the Next Bottleneck in AI Data Centers? — 光互联会是 AI 数据中心的下一个瓶颈吗？ 2026/08/11
• The AI Hardware Primer — AI 硬件入门：被忽视的真正瓶颈在硬件层 2026/08/10
• The AI Bottleneck Is Moving to Advanced Packaging, Three Japanese Companies Hold the Keys — AI 瓶颈正移向先进封装，三家日本公司掌握钥匙 2026/08/10
• Taiwan GTC (Computex 2026): CPO Just Entered Production, So Why Are Coherent and Lumentum, the Companies It Was Supposed to Kill, Still on the Supplier List? — 台湾、GTC 与 Computex 2026：CPO 已进入量产 2026/08/02
• July NPO/CPO Update: Stupidity Singularity — NPO/CPO 七月更新：激光护城河、VCSEL CPO 与 Nvidia 供应链变局 2026/07/25